Hitachi

サイト名称 日立ハイテク

Title Low FIB damage lamella preparation of Al plate using NX2000
Details HTD-FIB-E007
Overview “Low FIB damage lamella preparation of Al plate using NX2000”

Clean and less damaged aluminum lamella was prepared using triple beam system, FIB-SEM with incorporated argon ion column. 1kV argon ion milling after FIB processing allows clear imaging of polycrystalline grains or dislocations.

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Product type ・Focused Ion Beam Systems (FIB)
・Electron Microscopes (SEM/TEM/STEM)
Field 1 Materials science
Field 2 Metals / Magnetic materials
Information type Technical Note
Issue date 2016/09/26
Inquiry Inquiry
No. HTD-FIB-E007