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Title Wide Area Cross-Section Ion Milling for a Circuit Board with the ArBlade5000
Details HTD-SEM-E060
Overview
“Wide Area Cross-Section Ion Milling for a Circuit Board with the ArBlade5000”

6.5 mm ultrawide cross section of a printed circuit board was prepared by ion milling in 5 hours. Shape and elemental distribution of the interface between electrode and solder can be  clearly visualized by BSE imaging and EDX mapping at an arbitrary position in the ultrawide cross section.

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Related links (products)
Product type ・Field Emission Scanning Electron Microscopes (FE-SEM)
・Sample Preparation Devices for TEM/SEM
Field 1 Materials science
Field 2 Semiconductors (incl. materials) / Devices / Components / Displays & Lighting
Information type Technical Data / Data Sheet
Issue date 2018/04/25
Inquiry Inquiry
No. HTD-SEM-E060