“Wide Area Cross-Section Ion Milling for a Circuit Board with the ArBlade5000”
6.5 mm ultrawide cross section of a printed circuit board was prepared by ion milling in 5 hours. Shape and elemental distribution of the interface between electrode and solder can be clearly visualized by BSE imaging and EDX mapping at an arbitrary position in the ultrawide cross section.
Further details can be found on our membership website.
We would appreciate your joining.
About our membership site, see https://www.hitachi-hightech.com/global/science/guide/