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Title Cross sectional lamella preparation of a 64 layer 3D NAND
Details HTD-FIB-E073
Overview “Cross sectional lamella preparation of a 64 layer 3D NAND“

TEM lamella of 64-layer 3D NAND was prepared with uniform thickness. SiO and poly-Si at the center of channel holes were correctly observed in upper and lower regions of 5 μm deep cross section.

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Related links (products)
Product type Focused Ion Beam Systems (FIB)
Field 1 Materials science
Field 2 Semiconductors (incl. materials) / Devices / Components / Displays & Lighting
Information type Technical Data / Data Sheet
Issue date 2019/11/11
Inquiry Inquiry
No. HTD-FIB-E073