| Overview |
“Sequential multi-point cross-section ion millings of an electronic circuit board“
 Multiple cross sections were prepared by Broad Ion Beam milling system using “Milling Process Creator”,new function to allow high-throughput sequential processing under optimum conditions. 3 target regions were automatically processed at different accelerating voltages (7 kV, 6 kV, 8 kV and 2 kV) avoiding heat damage and ion damage in a much shorter time than processing whole area.
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