| Overview |
”Automated FIB process from sample extraction to TEM lamella preparation (3)”
 Fully automated TEM lamella preparation was executed with a fiducial marker on a real device. A lamella of SRAM was prepared targeting pMOS (plug diameter: approx. 120 μm). After automated processes of FIB marking, Micro-sampling (in-situ lift-out) and lamella processing, the targeted pMOS structure was successfully observed from two stage rotation directions (0 ° and 180 °)
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