| Overview |
”Micro sampling and TEM lamella processing on a MEMS heating chip by FIB”
 Remarkable FIB-compatible MEMS heating chip was developed in collaboration with Prof. Zhiwei Shan's team at Xi'an Jiaotong University. As shown in the optical microscope image, the heater section is thermally isolated from the base chip to realize uniform temperature control with minimal thermal drift. After common Microsampling (in-situ lift out) procedure, prepared lamella can be observed at high temperature with much higher stability.
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